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End effectors 
made of CFRP

LIGHTER. STRONGER. MORE PRECISE.

The CFRP end effectors from MURTFELDT combine high-precision handling with maximum lightweight construction expertise – for use in automated production environments in the semiconductor industry.

CFRP end-effectors combine low weight, high stiffness and long-term stability to meet the precision requirements of modern semiconductor manufacturing. Their mechanical, thermal and chemical properties can be tailored to specific process conditions, enabling reliable wafer handling even in confined spaces or demanding environments. 

Integrated vacuum channels ensure uniform flow and reduce potential leak points, whilst the composite structure guarantees tight tolerances, high flatness and minimal deformation across a wide temperature range. With a modulus of elasticity of up to 350 GPa at a density of approximately 1.5 g/cm³, CFRP offers a compact and durable solution for high-performance automation systems.

WHY CFRP? – YOUR ADVANTAGES AT A GLANCE

<p class="text-lg"><span class="text-deep-blue-9"><span class="font-bold">Maximum performance
<span class="font-normal">and strength with</span> minimum
weight</span></span></p>

Maximum performance and strength with minimum weight

<p class="text-lg"><span class="font-bold">Mechanical, thermal and chemical properties</span> can be precisely tailored to your application</p>

Mechanical, thermal and chemical properties can be precisely tailored to your application

<p class="text-lg"><span class="font-bold">High-performance material for complex geometries </span>and demanding applications</p>

High-performance material for complex geometries and demanding applications

<p class="text-lg"><span class="font-bold">Long service life</span> –&nbsp;low maintenance and stable processes even under extreme conditions</p>

Long service life – low maintenance and stable processes even under extreme conditions


Technology that moves – intelligent CFRP end effectors for precise processes

End effectors made from CFRP

  • Innovative manufacturing process enables the finest integrated vacuum channels for optimized handling of the wafers
  • Low installation height thanks to high rigidity for highest positioning accuracy and freedom of movement, even in confined spaces
  • Low weight – relieves robot axes, reduces energy consumption and enables shorter cycle times
  • Excellent corrosion resistance - Ideal for aggressive media and long product life cycles

Technical highlights – compact summary

  • Material: unidirectional carbon fiber (UD) + epoxy resin 
  • Temperature resistant: approx. -50 °C to +200 °C (higher on request) 
  • Manufacturing tolerance: ± 0.02 mm 
  • Flatness: approx. 0.1 mm 
  • Material thickness: realizable from 2.5 mm 
  • Rigidity: young‘s modulus up to 350 GPa 
  • Density: approx. 1.5 g/cm³

Moving together

EFFICIENT, COMMITTED AND SOLUTION-ORIENTED

  • Expert advice – digital & on site
  • Technical engineering at eye level 
  • Customized solutions for your requirements and ideas 
  • High precision & quality 
  • Speed & flexibility – even at short notice

Download flyer (PDF)

We are happy to help.

Niklas Knappkötter

Industry Management

industries@murtfeldt.de

Machining

Additive Manufacturing

Firbre Composites

Combined techniques